The 63rd JSAP Spring Meeting 2016
Session ID : 19p-S224-14
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Spring Meeting
Number : 63
Location : [in Japanese]
Date : March 19, 2016 - March 22, 2016
Induced stress during peeling release with various template stiffness in nanoimprint lithography
*Florian Chalvin, Takamitsu Tochino, Naoto Nakamura, Masaaki Yasuda, Hiroaki Kawata, Yoshihiko Hirai
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