The 77th JSAP Autumn Meeting 2016
Session ID : 14p-P9-17
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Autumn Meeting
Number : 77
Location : [in Japanese]
Date : September 13, 2016 - September 16, 2016
Ongoing Degradation Analysis for Power Semiconductor Die Attachment subjected to Thermal Cycle Test
*Mari Yamshita, Tatsuhiro Suzuki, Sawa Araki, Tetsuya Mori, Takashi Ogihara, Hidekazu Tanaka, Hisashi Yakumaru, Satoshi Tanimoto
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