The 65th JSAP Spring Meeting 2018
Session ID : 17p-P8-19
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Spring Meeting
Number : 65
Location : [in Japanese]
Date : March 17, 2018 - March 20, 2018
Evaluation of SCM Specifications in SCM/NAND Flash Hybrid SSD with Through-Silicon Via
Keywords:
17p-P8-19,
Through Silicon Via
Details
Article 1st page
