The 65th JSAP Spring Meeting 2018
Session ID : 19a-F310-8
Conference information
Host: The Japan Society of Applied Physics
Name : JSAP Spring Meeting
Number : 65
Location : [in Japanese]
Date : March 17, 2018 - March 20, 2018
Evaluation of bonded GaAs/Si and GaN/GaAs wafers
*Yuki Nakamura, Yoshiaki Ajima, Kenta Murakami, Hideo Teramoto, Ryota Jomen, Xing Zhiwei, Pan Dai, Shulong Lu, Shiro Uchida
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