JSAP Annual Meetings Extended Abstracts
Online ISSN : 2436-7613
The 69th JSAP Spring Meeting 2022
Session ID : 25p-E104-10
Conference information

Electrical characterization of adhesion property degradation in BN/Si devices
*Takayuki MatsudaTakashi HamanoYuya AsamotoMasao NomaMichiru YamashitaShigehiko HasegawaKeiichiro UrabeKoji Eriguchi
Author information
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Article 1st page
Content from these authors
© 2022 The Japan Society of Applied Physics
Previous article Next article
feedback
Top