抄録
In order to solve reuse problem of composite packaging, inventor introduces a recycling technology by which can made building materials, panel boards, by shredding and then heat-pressing waste carton. This product owns a competitor to chipboard, plasterboard and medium density fiberboard (MDF). Test report also shown that product has many unique physic characters. For example, the board, Chiptec, adopts glue free production, therefore it is completely free from formaldehyde, a harmful substance, forbidden by most developed countries for interior uses (furniture and decoration). It would benefit to human health. They are also strong and waterproof and because it is very resistance to heat and humidity induced expansion and contraction. In its production, there are very little waste materials. Chiptec is made largely from post consumer packaging collected from the domestic solid waste stream with some 30% mixture of factory waste. It is an excellent “recycling” example of how the old can be turned into the new for the benefit of all.
