気相堆積法と電気化学的メッキ

統合、二者択一又は併用―どれが最適か?

抄録

Physical and chemical vapor deposition (PVD/CVD) and electrochemical deposition (ECD, electroplating) both lead to film formation by the deposition of the material in the atomic scale. On the base of advanced vacuum and plasma technologies, PVD and CVD processes have found their role in coating and thin film deposition, even if not comparable with “traditional” processes regarding the application volume. A lack of knowledge coupled with bias towards one or other technique often results in a false estimation of their relative benefits. Also judging the processes as inexorably competing is an inappropriate approach.
On the base of the fundamentals of both techniques, the potentials and limitations are outlined. The major advantages of ECD are, e.g., the coatability of almost all substrate shapes, specific surface structures, possible leveling of surface roughness or positive structure design. Disadvantages might be the problems with hazardous substances and waste water. The major advantages of PVD are the almost unlimited variation in the chemical composition of the coating material, the principal tolerance of all substrate materials and the deposition of compounds like nitrides, carbides etc. or materials like carbon and diamond. Advantages are also the easy realization of layered or graded structures. Disadvantages are, e.g., the need of vacuum and plasma equipment and the line-of-sight process with the need for complex sample movement.
In practical application the one or the other technique will be applied. In other cases the processes might be competing, and often process combinations solve problems best. The final decision with respect to the process selection, however, is often governed also by non-technical aspects like economic and ecological facts.