1999 年 1999 巻 p. 19990023
The treatment of coupled phenomena involving liquids and solids in the finite element analysis is reported in this paper. The authors have developed and implemented a new methodology for adequately computing a structure/thermal fluid coupled problem. The reported methodology is based on the techniques of large-scale finite element analysis for solving incompressible viscous fluids, which were reported in the past by the authors. The new scheme allows the acquisition of the dynamic responses of the structures and fluids, at the same time. The developed program was implemented onto the CRAY-T3D and the various factors which influence the parallel efficiency were considered. As a sample numerical result, a problem involving the cooling of a LSI package is examined, to illustrate the effectiveness of this new methodology.