Bonding Strength Evaluation of a Metal-Resin Adhering Interface Formed by Resin Molding

抄録

Bonding strength of a metal (Fe-Ni alloy) and resin (epoxy base) adhering interface was examined under thermal stress occurring in the cooling process of the thermoset resin after adhesion. Thermal stresses on the adhering interface were calculated using the finite element method. Calculated stresses and the experimental strength were compared. The following results were obtained. Bonding strength of a metal and resin adhering interface under thermal loads can be estimated mainly by using shearing stress on the adhering interface (τ_yz) ; an accurate strength estimation can be obtained by taking into account the normal stress on the adhering interface (σ_z).