JSME international journal. Ser. A, Mechanics and material engineering
Print ISSN : 1340-8046
Two-Dimensional Thermal Stress Analysis of Butt Adhesive Joint Containing Rigid Fillers in the Adhesive
Fumito NakagawaYuichi NakanoToshiyuki Sawa
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ジャーナル フリー

1994 年 37 巻 3 号 p. 238-245

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抄録
Thermal stress distribution and thermal strength were examined when butt adhesive joints with rigid fillers in the adhesive were in steady-state temperature distribution. In the analyses, thermal stress distribution in the adhesive was obtained using the two-dimensional theory of elasticity in the case where adherends of the same size and rigid material were kept at a constant temperature and the side surfaces of the joint were surrounded with fluid of a different constant temperature. Numerical calculations showed that thermal stress was tensile near the edges of the interface between the adherend and the adhesive layer, that around the interface area underneath which the filler was located, the thermal stress was concentrated at the periphery of the filler, and that a large amount of thermal stress was generated when the filler size was large. Photoelastic experiments were carried out, and the analytical results were shown to be consistent with the experimental ones.
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© The Japan Society of Mechanical Engineers
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