抄録
This paper presents tensile properties of a polyimide thin film used in electronic devices. Tensile tests were performed to determine Young's modulus, proportional limit, yield stress, ultimate tensile strength and elongation of the polyimide film. Effects of strain rate and temperature on the tensile properties were discussed. There was a little effect of strain rate on Young's modulus but proportional limit, yield stress and ultimate tensile strength increased with increasing strain rate. Only elongation decreased with strain rate. Young's modulus, proportional limit, yield stress and ultimate tensile strength decreased with increasing temperature, but elongation increased. Applicability of a viscoelastic model for describing the stress-strain curves of the polyimide film was discussed.
