OS2-13 Thermal Strain Measurement of Electronic Packaging Structure Using Highly Accurate Digital Image Correlation(Digital image correlation and its applications (4),OS2 Digital image correlation and its applications,MEASUREMENT METHODS)

Yasuhisa Fujimoto; Shuichi Arikawa; Riku Yoshida; Yohei Omoto; Satoru Yoneyama

doi:10.1299/jsmeatem.2015.14.32

Abstracts of ATEM : International Conference on Advanced Technology in Experimental Mechanics : Asian Conference on Experimental Mechanics

Online ISSN : 2424-2837

セッションID: OS2-13

DOI https://doi.org/10.1299/jsmeatem.2015.14.32

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OS2-13 Thermal Strain Measurement of Electronic Packaging Structure Using Highly Accurate Digital Image Correlation(Digital image correlation and its applications (4),OS2 Digital image correlation and its applications,MEASUREMENT METHODS)

Yasuhisa Fujimoto, Shuichi Arikawa, Riku Yoshida, Yohei Omoto, Satoru Yoneyama

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Proceedings of the Asian Pacific Conference on Fracture and Strength and International Conference on Advanced Technology in Experimental Mechanics

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