In this paper, the history of experimental mechanics, especially, focused on the moire methods in Japan is described. The studies of the author's group are also introduced including the whole-space tabulation method, the light-source-stepping method, the sampling moire method and the one-pitch phase analysis method. The applications of these methods to shape, deformation and strain measurement are presented.

抄録全体を表示

Digital holography (DH) has been used to measure aspherical micro lenses. By numerical reconstruction of the recorded digital hologram, the amplitude and phase information can be reconstructed numerically with high resolution. However, the field of view (FOV) in digital holography is limited by the size of sensor chip and the illumination beam divergence. Hence for micro-lenses DH works quite well. However for larger lenses, a single shot is not adequate to cover the whole field of view. To overcome this, stitching of images is usually done. Sequential stitching of images/holograms is tedious due to the enormous data that is needed. In this paper, we demonstrate a novel stitching algorithm which can reduce the large data processing and provide a stitched image with high quality and resolution. The proposal is validated using a DH system based on a modified Twyman-Green configuration. The holograms are recorded automatically using a motorized X-Y stage.

抄録全体を表示

By Taguchi design method-L_9(3^4), the parametric combination for maximum retardance in citrate-coated ferrofluids (FFs) is determined. Multiple regression (MR) is completed by Excel. Moreover, Taguchi measured results were used as training data in the feed forward artificial neural network (ANN). Computed results in MATLAB showed the ANN model had a high correlation coefficient of 0.9999998, close to 0.9999999 obtained by MR. Hence the trained ANN was able to predict the maximum retardance of 33.41°, with a relative error of 2.17% to MR.

抄録全体を表示

Recently, semiconductor product (package or PKG) becomes smaller and thinner because of requirement of market. To realize the small PKG, 3D/2.5D structures are studied by many manufacturers. TSV (Through Silicon Via) and interposer substrate is famous as 3D/2.5D structure. These structures contain microscopic bumps to connect between silicon chips or between silicon chip and substrate. Diameter of these bumps reach 100 microns or several microns and height reach tens of microns. Total inspection on manufacturing process is important to prevent product failure and ensure quality. However it is difficult to apply total inspection to in-line process because bumps are too small to ensure inspection result and too many to keep throughput of manufacture process.

抄録全体を表示