Proceedings of the Asian Pacific Conference on Fracture and Strength and International Conference on Advanced Technology in Experimental Mechanics
Online ISSN : 2433-1279
2.01.03
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Photoelastic Investigation of Bimaterial Interfacial Stresses(Optical Method 1)
Wei-Chung WangJen-chang Lin
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会議録・要旨集 フリー

p. 778-783

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抄録
In this paper, the photoelastic technique was employed to investigate the interfacial stresses in bimaterial structures. The effect of thermal loading was studied. The whole-field stress distribution of the test specimen can be observed during the thermal loading. The experimental results revealed that severe local stress concentrations were induced in the vicinity of the edges in the interface. The maximum fringe order near the interface was found to be about six times of that near the top surface of the photoelastic material when the heating temperature was raised to 65 ℃. In comparison with the theories developed by other investigators, severe stress gradient was found across the specimen's height. The numerical analysis was also performed and compared with the experimental results.
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© 2001 The Japan Society of Mechanical Engineers
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