抄録
This paper examines the problem of thermal cracking under a transient temperature field in a ceramic/metal functionally graded plate. When the functionally graded plate is cooled from high temperature, it could be observed that curved or stright multiple cracks occur on the ceramic surface. In addition, those multiple cracks influence each other and form complex arrays. To investigate mutual effect among multiple cracks, crack paths are simulated in a mode I and II state using finite element method. Transient thermal stress field and crack growth are treated as a linear quasi-static thermoelastic problem for a plane strain state.
