抄録
Aimed at the methodology of package heat transfer analysis, this paper presents a simple computation model for the thermoflow simulation of a module PBGA package mounted on printed circuit board that is bonded in a compact box of air cooling. Having been validated by comparing computational results of temperature rise with experimental ones, the model is applied to the heat transfer analysis of the package model. The correlations of thermal resistance with system parameters have been investigated. Computational results show that the thermal resistance decreases with the increase of mean flow velocity and it has a local minimum value corresponding to the height of clearance between the substrate and the box bottom under a relative strong forced convection.
