計算力学講演会講演論文集
Online ISSN : 2424-2799
セッションID: 447
会議情報
447 電子デバイス接続部の熱変形解析 : 粘塑性構成式の導入(OS01-4 電子デバイス実装・電子材料と計算力学(4))(OS01 電子デバイス実装・電子材料と計算力学)
柳本 陽征石川 博將佐々木 克彦
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会議録・要旨集 フリー

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In this paper, viscoplastic constitutive model for deformation of Pb free solder alloys was proposed. FEM analysises of microelectronics solder joints was also conducted using the viscoplastic constitutive model. For the FEM analysis, basic experiments, such as pure tension, cyclic loading and creep tests were conducted using Sn-3.5Ag-0.75Cu solder alloy at several tests conditions. As a result, it was found that the thermal deformation of the solder alloy was successfully simulated by the FEM analysis, into which the constitutive model was incorporated.
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© 2001 一般社団法人 日本機械学会
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