The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2002.15
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Bond strength and reliability in packaging structures of chip parts
Nagatoshi OKABE, Xia ZHU, Manabu TAKAHASHI, Keiji OGI, Tsuyoshi KII
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Keywords: Bond strength, Residual stress, Thermal cycle test, Superposed stress, Stress intensity factor
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Pages 787-788

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© 2002 The Japan Society of Mechanical Engineers
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