Development of the repetitive drop test equipment and drop impact evaluation for the solder joints
Qiang YU, Hironobu Kikuchi, Keiji WATANABE, Manabu KAKINO, Noriyuki FUJIWARA, Masaki SHIRATORI
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Keywords:
Dynamic Behavior,
Dynamic Analysis,
Response Analyssi,
Impact Reliability,
Impact Fatigue,
BGA Package
Pages 789-790
Details
Article 1st page
