抄録
A mismatch of material properties in joints may cause stress singularities, which lead to the failure of the bonding part. It is very important to reveal a stress singularity field for evaluating the strength of interface in three-dimensional joints. Furthermore, thermal residual stresses occur in a cooling process after bonding the joints, and the stress singularity for thermal stresses also occur. In the present study, the intensity of singular field at the edge in the interface Si-resin joint with different thickness in silicon is investigated using boundary elemant method.
