The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2013.26
Session ID : 102
Conference information
102 Microstructural Analysis of Low-cycle Fatigue Damage Process of Sn-Ag-Cu Solder alloy
Hiroyuki KONTANI, Yoshiharu KARIYA, Kensuke OGAWA
Author information
Keywords: Sn-Ag-Cu solder, Low-cycle fatigue, EBSD, Crack propagation behavior
CONFERENCE PROCEEDINGS FREE ACCESS

Details
Download PDF (402K)
Download citation RIS

(compatible with EndNote, Reference Manager, ProCite, RefWorks)

BIB TEX

(compatible with BibDesk, LaTeX)

Text
How to download citation
Contact us
Article 1st page
Content from these authors
© 2013 The Japan Society of Mechanical Engineers
Previous article Next article
Favorites & Alerts

Recently viewed articles
Announcements from publisher
Share this page
feedback
 Top