The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2013.26
Session ID : 103
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103 Effect of material modeling on warpage analysis of solder-bonded layered plates
Nobutada OHNO, Hisashi TANIE, Satoshi MIZUSHIMA
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Keywords: Warpage, Solder-bonded layered plates, Constitutive behavior, Cyclic thermal loading
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© 2013 The Japan Society of Mechanical Engineers
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