The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2013.26
Session ID : 104
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104 Thermal stress analysis of through-hole print circuit board considering the non-linearities of component materials
Yuu YAMAYOSE, Tetsuya KUGIMIYA, Kenji HIROHATA
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Keywords: FEM, Simulation, print circuit board, constitutive model
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[in Japanese]
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© 2013 The Japan Society of Mechanical Engineers
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