The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2013.26
Session ID : 110
Conference information
110 Evaluation Method of Warpage and residual stress of Semiconductor Package and Electronic Characteristic Changes of Stress-induced.
Kazutoshi MATSUDA, Toru IKEDA, Masaaki KOGANEMARU, Noriyuki MIYAZAKI
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Keywords: Finite Element Method, Stress Singular Field, Residual Stress, Piezo
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[in Japanese]
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© 2013 The Japan Society of Mechanical Engineers
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