Krylov部分空間法を用いた３次元伝熱モデルの１次元への縮退による流れを考慮した過渡伝熱解析技術

抄録

In semiconductors packages, heat generation density is increasing due to miniaturization. Since heat generation is caused by voltage input at the packages, electronic components are usually cooled by air. In recent years, electrification is widely spread among many engineering products like motor vehicles, and the amount of semiconductors packages installed in those products as well. To make the electronic components more densely installed, co-simulation of heat transfer analysis and electrical circuits is needed at designing products. In this paper, by using the Krylov-subspace model order reduction method, the accuracy of one-dimensional heat transfer analysis model concerning cooling effect of air is evaluated. By using the method, co-simulated with electrical circuits is possible.