抄録
This paper proposes a new method of handling microchips. In this method, a chip is picked up with a water drop at the head of a nozzle. According to the self-centering effect, the chip comes to the bottom of the water drop automatically. This method has an advantage of catching up and positioning the chip even if there is a deflection between the nozzle and the chip. Fundamental performances of this method are studied experimentally.
