抄録
Thermal design of electronic equipment in early design stage is the most effective way for reducing the material cost, product size and total developing time. To realize the frontloading thermal design, accurate estimation method of device power dissipation must be required. However, there is no way to measure the power dissipation of inverter due to the variation of device properties, test conditions and so on. We apply an identification method using response surface methodology (RSM) with CFD to estimate the power dissipation of multiple devices on printed wired board. As a verification result, identification error in total power is just 3.4%. This practical approach improves the accuracy of early thermal design quality dramatically.
