抄録
Miniaturization technology based on Dennard's rule for CMOS devices has progressed consistently over time and has had a profound impact on mankind and the world. Lithography has also made amazing progress up to this point, achieving high resolution at 28nm-L/S or below using 193nm ultraviolet (UV) light. However, the probability is low that production of ever-finer feature geometries will continue, because resolution capabilities will likely reach a critical limit due to CMOS performance threshold, as well as chip economics. Therefore, to ensure continued performance improvements and create added-value by miniaturization of future devices, attention should be focused on new three dimensional (3D) integration and other novel technologies. In addition, a new technology management strategy is imperative. In this paper, we first describe the current status of the semiconductor industry. Then, a new methodology of technology management for this market segment based on the IC's compounded annual growth rate (CAGR) and a tool's book to bill ratio (B/B) is discussed. Finally, we focus on the criticality of an innovative System Design approach that will offer international competitiveness and enable profitably for all Japanese companies.
