抄録
Recovery of rare metals and base metals from electric waste (E-waste) would be of interest because of a sharp global-scale increase in commodity prices. In this study, a new material recycle process from waste electronic circuit boards using high frequency induction heating was proposed. Heating and separation examination was carried out using thin and nexible electronic circuit boards. Although it is difficult to heat up good electric conductor by induction heating, the temperature of these samples sufficiently increased and thermal decomposition of resin in these boards was confirmed. Separation between metal and resin film of these boards after induction. heating could be made easy. Moreover, optimal operating conditions of induction heating for the separation were clarified by several experiments.
