高周波誘導加熱による金属-樹脂薄膜一体構造物の分離挙動

抄録

Waste flexible printed circuit (WFPC) contains a number of precious resources such as base and noble metals. In this research, we propose a new separation / recovery technology using high frequency induction heating as a recycling process of WFPC. The peeling strength of the sample heated by high frequency induction heating was quantitatively evaluated using a tensile tester, and the effect of sample dimensions and heating conditions on adhesive properties was experimentally investigated. As a result of the high frequency induction heating experiment, it became clear that the coil current when the FPC simulated sample is peeled decrease with increase in heating area and decrease in sample thickness. As a result of the tensile test, there was a difference in peeling behavior between the unheated sample and the heated sample. It was found that the peeling tensile force of the heated sample increased with increase in the coil current. In addition, the peeling tensile force showed a tendency to decrease after reaching the maximum. Ultimately, the peeling tensile force of the sample heated at the critical current value was decrease than that of the unheated sample.