抄録
ITRS gave us technical limits on 2005,i.e. Red Brick. In order to break Red Brick, new materials will be adopted in device design side. In process and tool side, wet process is now highlighted to give one of solutions to challenge on Red Brick, such as CMP, ECD etc. Wet process for new materials, ECD for super aspect ratio, CMP for super planarization, cavitation jet cleaning and air flow analysis as dryin-fry-out for contamination control and thermal release problems are shown herein. Thermal and fluid mechanics in nano meter or micron meter level would help science approach in wet revolution decade.
