抄録
Recently, as a integrated circuit improves accumulation, the technology progress very rapid in multilayer and miniaturization of architecture. For instance, the Pentium 4 that is CPU for the personal computer is eight layer structure. The technology of planarization process becomes extremely important for multilayer structure. As the solution to multilayer planarization, recently, processes using a fixed abrasive pad or a grinding wheel have been examined as a potential alternative. We proposed the new planarization process named Chemo-Mechanical Grinding. Therefore, in this research, we will experiment by using Shallow Trench Isolation patterned Wafer.
