次世代デバイス用ナノレベル研磨・洗浄複合システムの開発のための基礎研究(マイクロナノ理工学,IIP2004 情報・知能・精密機器部門講演会)

抄録

In order to polish the glass substrate for HDD, new novel polishing system with electric field was proposed. Electric field provides kinetic energy to abrasives. These abrasives scratch and rub the glass Surface and realized the super smooth glass substrate that surface roughness is less than 0.5nmRa. In order to realize this system, the movements of abrasives are observed. The effect of frequency and the strength of electric field on mean velocity are elucidated. After the decision of optimum electric field, glass plate was polished. After 60 min of polishing time, surface roughness of glass plated was reduced from 5.1nmRa to 0.49nmRa.