IIP情報・知能・精密機器部門講演会講演論文集
Online ISSN : 2424-3140
セッションID: D-2-5
会議情報
D-2-5 カンチレバー表面のエッチングダメージが及ぼす機械特性への影響評価手法の提案(D-2 設計・プロセス,口頭発表:マイクロナノメカトロニクス)
植木 真治西森 勇貴今本 浩志久保田 智広杉山 正和川勝 英樹寒川 誠二橋口 原
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会議録・要旨集 フリー

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We propose a method to evaluate the effect of process damage on microcantilever surfaces, introduced by processes such as plasma etching, on their mechanical properties. Using this method, we can compare the mechanical properties before and after etching even if the process changes the microcantilever thickness. Defects at the microcantilever surface affect the quality (Q) factor of the micro cantilever, but the Q factor cannot be used as an indicator to evaluate process damage because it also depends on the microcantilever thickness. On the basis of theoretical considerations, we propose using Q/f (f: resonance frequency) as an indicator because both Q and f are proportional to the thickness for very thin microcantilevers. We verified our method experimentally by etching microcantilever surfaces using conventional plasma etching and neutral beam etching, which can etch silicon without damage. As a result, the Q/f value markedly decreased after plasma etching but stayed nearly the same after neutral beam etching.
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© 2011 一般社団法人 日本機械学会
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