IIP情報・知能・精密機器部門講演会講演論文集
Online ISSN : 2424-3140
セッションID: I-2-1
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I-2-1 触媒表面反応を利用した新しい研磨法によるGaN基板表面の平坦化(窒化物半導体デバイスの精密加工プロセス-結晶基板の将来加工技術-,口頭発表)
佐野 泰久定國 峻浅野 博弥八木 圭太有馬 健太山内 和人
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It is very difficult to produce a smooth and damage-free gallium nitride(GaN) surface using the conventional polishing method utilized for silicon wafer processing because of the hardness,brittleness and chemicalinertness of GaN.We have developed a novel polishing method named CARE(catalyst-referred etching),which is an abrasive-free chemical polishing method involving a chemical reaction between the surface of a workpiece and a catalytic plate in a chemical solution or pure water.Here,we report that a GaN substrate with a damage-free and atomically smooth surface can be obtained by the CARE process

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