抄録
In recent years, the research and development of devices using thin and flexible plastic films as substrates has been actively conducted. However, thin films, which have been growing in demand in recent years, have problems when rolled. Therefore, in this study, the physical properties were measured using a thin plastic film, the stress analysis was performed using the plastic film, and the internal stress of the roll was actually measured to evaluate the effect of thinning. As a result, it was found that the analyzed stress of the winding roll using the thin film was much lower than the measured value.
