抄録
A combined experimental and modeling (both numerical and analytical) approach has been devised to understand the material removal mechanism during abrasion of ductile copper discs. First, single grit scratch intersection experiments are conducted at the micro-scale (with 1-30μm depth of cut). This is followed by FEM analysis. Then a simple analytical model is developed, and the model prediction is verified against experimental observations and results from numerical simulations. The insights gained from this exercise may be used to develop a mechanistic model of material removal in chemical mechanical polishing (CMP) of ductile materials.
