抄録
Currently, standard molding inserts in LIGA or UV-LIGA consists of nickel. However, electroplated Ni has internal stress that leads to significant distortions in thicker deposits and it starts to recrystallize at lower annealing temperatures suffered during molding processes. We investigated optimum electroplating parameters to attain low internal stresses and high strength Ni mold inserts durable among the plastic moldings. We also demonstrated the fabrication of high aspect ratio Ni mold inserts using X-ray lithography at the Synchrotron Radiation Facility "New SUBARU" of Himeji Institute of Technology.
