抄録
Recently, lead-free solder alloys have been developed as substitutes on conventional Sn-Pb solders, and the investigation and the improvement of their mechanical properties at elevated temperatures are very important In the present study, creep properties of a Sn-Ag-Cu lead-free solder alloy were studied under constant tensile load. Also, creep tests of metallic particles/lead-free solder composites were conducted, and die possibility to improve the creep resistance was discussed.
