Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : March 12, 2018 - March 13, 2018
The purpose of this study is to clarify the effect of fresh surface oxidation/surface oxide layer on fatigue crack propagation of copper (Cu) submicrometer-thick films. Fatigue crack propagation experiments in approximately 500-nm-thick Cu films were conducted in both air and vacuum environments. In addition, environmental change experiment and in situ observation of fatigue crack opening/closing behavior were conducted. On the basis of the comparison of fatigue crack propagation behavior, fracture surface morphologies and crack opening/closing behavior, the effects of vacuum environment on fatigue crack propagation properties of submicrometer-thick films are discussed.
