抄録
Light emitting diode (LED) will be new light source for automotive forward lighting system in the near future. One of the fundamental technologies as to control LED is how to manage the maximum junction temperature on a tip under the phosphor. Whereas, heat sink is used as a basic and reasonable device for thermal diffusing, effects of heat sink's shape and dimension are not specified for LED application. In this paper, temperatures of three different heat sinks were calculated by CFD tool using with three dimensional model including LED, heat sink and air. The junction temperatures obtained from calculation were compared with estimated junction temperatures based on measured temperature under the bottom of the LED, because of difficulty to measure the junction temperature directly. The results of our study indicates that junction temperature is predictable using CFD.
