抄録
Cu films were annealed after surface diffusion of Cu-P alloy to Cu, to development the spring materials which reserved internal electrical resistance with high surface strength, Cu films were diffusion treated after Cu-P deposition. Spring recovery rate were increased with increasing the diffusing temperature (over 0.5Tm) and diffusion time. From the aspect of electrical resistance, it has succeed to keep the value 1/2 compared to that of Ni which is already in practical use.
