21803 銅めっきの沸騰冷却への効果(明日に向けた熱と物質移動の新展開(1),OS.6 明日に向けた熱と物質移動の新展開)

抄録

Phase change heat transfer is being paid increased attention for cooling next-generation electronic devices. Using the latent heat of vaporization, cooling modules may achieve an unprecedented level of heat flux, while limiting the surface temperature. The present study developed a test module to examine the effects of porous plating on boiling heat transfer on a flat surface. In the experiments using an organic refrigerant HFE-7100, the plated surface consistently provided bubble nucleation sites on the heated surface, resulting in lowering the temperature for incipient boiling and a maximum of 70 percent increase in heat flux compared to a flat surface without plating. The increased number of nucleation sites also allowed limiting the diameter of departing bubbles, an important effect when this plating is considered for microchannels whose width may be on the order of the bubble size. It is speculated that this is due to the surface morphology of the porous plating as well as the thermophysical properties of the fluids.