抄録
This paper provides a reliability of solder joints on electronic devices. This study clarifies a dependency of the surface tension in liquid lead free solder (Sn-Ag-Cu alloy system) on plate temperature under inert gas condition filling with Nitrogen. The surface tension of the lead free solder based on the Laplace theory is obtained numerically by using sessile drop profiles as boundary condition. The sessile drop profile is measured by the optical image method with CCD camera. Effects of the plate temperature on the surface tension are clarified experimentally. The results contribute development of geometrical shape design of the solder joint on the electronic devices.
