1720 電気力顕微鏡法(EFM)を用いたCMP欠陥の検出(OS1-1 機械工学が支援する微細加工技術I,OS1 機械工学が支援する微細加工技術)

抄録

We investigated surface potential with electrostatic force microscopy (EFM) to analyze the relationship between surface potential and chemical mechanical planarization (CMP). We have succeeded to detect the non-visual defects (NVD) such as organic (surfactant) and complex residues (Cu-BTA) Scratches and polishing non-uniformity those were not detected in topographic image were also cleary seen in surface potential images EFM metrology is markedly useful for evaluating the relationship between surface potential and defect generation during CMP.