抄録
The stress generated in micro-molded parts formed by ultraviolet (UV) curable resin was analyzed using a photoelastic technique. The stress was expressed as isochromatics in a dark-field circular polariscope. The specimens consisted of steel molds with flat, step and concave bottom surfaces, glass plates and UV curing resin in liquid form. The specimens were illuminated with UV rays downwards from the upper side of the specimens, and the photoelastic images of the resin during curing were captured using a digital camera. Results indicated that the stress generated in the resin varied depending on the bottom surface of the molds.
