日本機械学会関東支部総会講演会講演論文集
Online ISSN : 2424-2691
ISSN-L : 2424-2691
セッションID: OS0109
会議情報
OS0109 回転加速度を受けるシリコンウェーハ上の液滴の挙動
藤井 雄大天谷 賢児五十嵐 雄太関 涼斗檜山 浩國福永 明濱田 聡美
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会議録・要旨集 フリー

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Droplet behavior with rotational acceleration was experimentally investigated. The experiments were carried out using hydrophilic (Type-A) and hydrophobic (Type-B) wafers as the test pieces. Deformation and movement of droplet on wafer by rotational acceleration were visualized by a video camera. Characteristics of droplet migration were evaluated. Two types of droplet migration patterns were observed. The droplet on TypeA was deformed in the direction of acceleration, and the elongation with trace leaving on the wafer was observed. On the other hand, droplet on TypeB was moved without large deformation. This characteristic observed on the occasion of migration.
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