抄録
In the study of copper and cobalt corrosion, a microfluidic device was used to provide an experimentally controlled environment of flux and atmosphere. Copper layer formed by the electroplating method and cobalt layer formed by the sputtering method were reacted with water which was controlled the concentration of dissolved oxygen and carbon dioxide to high or low by bubbling method. In each experiment, linear flow velocities (LV) above the metal layer were controlled to 50 cm/s, and flow time was varied 30 to 120 min depending on the corrosion rate of metal layers. After each experiment, surface of metal layer was observed by SEM and roughness was measured by AFM. Although both of copper layers formed by sputtering and formed by electroplating were most corroded in water in which both of oxygen and carbon dioxide concentration was high, the corrosion rate of electroplated copper layer was smaller than that of sputtered copper layer. In the case of sputtered cobalt layer, corrosion rate was higher in low oxygen concentration water than high oxygen concentration water, unlike the sputtered copper layer.
