CuO下地膜を用いた石英ガラス基板上へのレーザ焼結Cu膜形成

抄録

For the spread of 5G communication technology, the substrate materials with low dielectric constant used for electronic devices to increase the signal transmission speed of electronic equipment. In this research, we selected a silica glass substrate as the substrate material, which is expected to improve the signal transmission speed by 1.5 times than a glass epoxy substrate. We tried to form copper films on a silica glass substrate utilizing laser sintering method, since large environmental load in wet plating process. In this research, a laser sintered Cu films were formed on the CuO base films formed on the silica glass substrate. Laser-sintered Cu films with width of 75 μm and thickness of 10 μm were formed on CuO base films. With increasing of laser power for sintering of Cu microparticles, the line width of Cu films increased, and the thickness of Cu films decreased. However, no conductivity of laser-sintered Cu films was obtained due to poor sintering of Cu microparticles.