半導体ウェーハのブラシ洗浄による微粒子除去に関する研究

抄録

The removal of particles on a wall surface by polyvinyl alcohol (PVA) roll brush was experimentally investigated as the fundamental study of wafer cleaning process. As the test particles, fluorescent silica powder were used. Change of the particle number near the wall surface before and after passing through the brush was investigated. Ejection of particles from the brush to the cleaning water was also estimated. Particles were removed by brush passage, however the particles re-adhered from the brush to the surface. It was also found that removed particles adhered to the surface on the inside of the brush and were ejected to the cleaning wafer at the next passing of brush.